Im not saying SLA resin wont work...but it might not work very well. SLA typically uses lasers with an output of 325nm to 355nm.
The short arc mercury lamp typical to dlp projectors (the heart of an Etec machine) has a poor output in this range....
Etec primarily uses Irgacure 819 as their photoiniator, Irgacure 369 to a lesser degree, and a very select few use Irgacure 784.
Irgacure 819 (BAPO) CAS#162881-26-7 is also used in many SLA resins however the
sensitivity curves allow them to use much less (.01-.1% by weight) then Etec (typical formulated at 1-5%)
If you intend to use an sla resin Id recommend spiking the mix with additional BAPO...sigma aldrich carries it...over priced but if your not buying it by the kg....you wont get much better pricing.
Not to argue with Scott, he really knows his stuff, but despite the lack of heaters there IS wax in the WIC formulas....a polyethylene based synthetic wax added to both weaken the polymer matrix and allow for more rapid burnout due to its lowered melting/vaporization point....did you mean petroleum based wax when you said "real" perhaps? Either way the thinwall and hollow structure recommendations are really the only way to get reasonable success with any photopolymer.
Finally, Id recommend avoiding Etec "dental resins" they are terribly overpriced...
Wic100 or PIC100 at $400/kg are decent alternatives to
WIC300 at $989/kg a good burnout cycle for pic100
Raise temp to 150ºC (300ºF)
5ºC per min
Hold for 3 hours
Raise temp to 370ºC (700ºF)
5ºC per min
Hold for 2 hours
Raise to temp 540ºC (1000ºF)
5ºC per min
Hold for 5 hours
Raise temp to 870ºC (1600ºF)
Normal rate
Hold for 4-5 hours
Oh and the shield....isnt protecting the user nearly as much as it is protecting the resin itself from partial photoinitiation from incidental light.
Hope this helps